Please check assembly instructions!
Wakefield-Vette's 27 x 27 x 23mm Pin Fin heat sink uses natural convection and thermal resistance of 9.44 C/Watt.
The heatsink is mounted on the chipset.
Features
- Heat sink with modified clip for precise fit on TE0741 (Revision 04/05)
- Heat dissipation material: aluminum
- Shape: Square, Pin Fins
- Fin type: elliptical pin
- Size: 27 x 27mm
- Height from base (height of pins): 22.65 mm
- Material Finish: Black Anodized
- Weight per piece: ca. 18 g
- Mounting method: Clip mounting
Scope of Delivery
- 1 x Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 and 05
- 1 x Heat conduction pad 25 x 25 mm
Additional Information
- Manufacturer: Wakefield-Vette
- Manufacturer's part number: 904-27-2-23-2-B-0
- Download Data SheetPin Fin Heat Sink
- Download Assembly Instructions
- Overview modules TE0741 series
- Trenz Electronic Wiki for 30313 heatsink
- Trenz Electronic Wiki Cooling Solutions Overview
- Support Forum
Trenz Electronic GmbH
Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05 (33013)
Please check assembly instructions! Heat dissipations Chipset Heat Sink with Clip for the modules TE0741-04 and 05
Código de artículo VAR-827003494
Número de pieza del fabricante: 33013
Código aduanero: 84715000
Nivel del stock: 0
Nivel del stock: más de 100
Nivel del stock: ${ $store.getters.currentItemVariation.stock.net }
El producto se envía desde Riedlingen, Alemania.
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