Product Description

The AXRF67 development board is built around the AMD Xilinx Zynq UltraScale+ RFSoC ZU67DR. It provides 4 physical RF-ADC interfaces (2.95GSPS) and 2 physical RF-DAC interfaces (10GSPS), leveraging the chip's full 8-channel capability while offering optimized connectivity for target applications. It supports direct RF sampling below 7.125GHz, delivering a comprehensive solution for 5G communication, radar systems, and wired access testing from teaching labs to research verification.

Applications

-> 5G FR1/FR2 Baseband & RF Systems
-> Wideband Spectrum Monitoring & Analysis
-> Phased-Array Radar / Digital Array Radar (DAR)
-> Satellite Communications
-> Multi-channel RF Signal Processing (for SDR, test equipment)
-> Test & Measurement (T&M) Systems

Key Features

System-on-Module
-> AMD/Xilinx Zynq™ Ultrascale+™ DFE ZU67DR:
-> 489K Logic Cells
-> 8 x 14 bit 2.5GSPS RF-ADC
-> 2 x 14 bit 5.9GSPS RF-DAC
-> 8 x 14 bit 10GSPS RF-DAC
-> ARM® quad-core Cortex™-A53 up to 1.333GHz
-> ARM® dual-core Cortex™-R5F up to 533MHz
-> 16nm FinFET+ FPGA fabric
-> Hardened DFE (Digital Front-End) with integrated RF-ADC and RF-DAC-> 4 GB (64-bit) DDR4 SDRAM on PS
->2 GB (32-bit) DDR4 SDRAM on PL
-> 128 MB QSPI Flash
-> Expansion: 2×400-pin high-speed connectors to the base board
Base Board
-> 1 x 100G QSFP28
-> 1 x 10G SFP+
-> 1 x M.2 SSD (PCIe Gen2 x2)
-> 1 x Gigabit Ethernet
-> 4× RF-ADC Input Interfaces
-> 2× RF-DAC Output Interfaces
-> 1 x USB3.0
-> 1 x DisplayPort
-> 1 x Type-C (JTAG + UART)
-> 1 x Micro SD Card Slot
-> 2 x PMOD Expansion Interfaces
-> 1 x High-precision GPS Module
-> 4× User-programmable LEDs
-> Power Switch & Reset Button
-> 9-40V Wide Voltage DC Input
-> Dimensions: 170mm x 170mm form factor

Caractéristique technique	Valeur
ID de l’art.	103794
État
ID de l'ancien article
Modèle	AXRF67
Fabricant	Alinx Electronic Limited
Pays de fabrication	Chine
Contenu	1 pièce
Poids	1000 g

Development Board Features

Featuring the AMD/Xilinx's Zynq UltraScale+ RFSoC XCZU67DR-2FFVE1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq UltraScale+ RFSoC based application.

* The AXRF47 development board consists of a ACRF67 SoM and base board. If you want to purchase ACRF67 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Zynq UltraScale+ RFSoC ZU67DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

System-on-Module	1	Base Board	1
Heatsink Kit (preinstalled)	1	12V power supply	1
SMA-SMA?20cm?	4	SMA-SMA?50cm?	2
5G omnidirectional antenna and base	4	USB3.0-cable	1
Ethernet cable	1	TF card	1
TF card reader	1	CD supplementary materials	1