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Trenz Electronic GmbH
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4(TE0818-02-BBE81-A)
AMD/Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GByte DDR4, 128 MByte SPI Boot Flash, Samtec ADM6-60 connector, size: 5.2 x 7.6 cm
Item number VAR-827002590
Manufacturer Product Number: TE0818-02-BBE81-A
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
USD 1,691.98
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Content
1 piece
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Technical characteristic | Value |
---|---|
Item ID | 102191 |
Condition | New |
Legacy item ID | 3806 |
Model | TE0818-02-BBE81-A |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 72 g |
Net weight | 72 g |
Customs tariff number | 84718090 |
FPGA Module with AMD Spartan™ 6 LX75-3I, 512 MByte DDR3L, Mini-USB 2.0, 4 x 5 cm(TE0630-03-63I22-A)
USD 316.29 *
* Excl. VAT
excl.
Shipping
AXKU062 V2.0 FPGA Dev Board & Kit with AMD Kintex US+ XCKU060
USD 1,481.07 *
* Excl. VAT
excl.
Shipping
Heat Spreader for Trenz Electronic MPSoC Modules TE0808-05
RRP USD 33.53
USD 10.58 *
* Excl. VAT
excl.
Shipping
FPGA Module with AMD Spartan™ 6 LX75-3I, 512 MByte DDR3L, Mini-USB 2.0, 4 x 5 cm(TE0630-03-63I22-A)
USD 316.29 *
* Excl. VAT
excl.
Shipping
AXKU062 V2.0 FPGA Dev Board & Kit with AMD Kintex US+ XCKU060
USD 1,481.07 *
* Excl. VAT
excl.
Shipping
Heat Spreader for Trenz Electronic MPSoC Modules TE0808-05
RRP USD 33.53
USD 10.58 *
* Excl. VAT
excl.
Shipping
FPGA Module with AMD Spartan™ 6 LX75-3I, 512 MByte DDR3L, Mini-USB 2.0, 4 x 5 cm(TE0630-03-63I22-A)
USD 316.29 *
* Excl. VAT
excl.
Shipping
AXKU062 V2.0 FPGA Dev Board & Kit with AMD Kintex US+ XCKU060
USD 1,481.07 *
* Excl. VAT
excl.
Shipping
Heat Spreader for Trenz Electronic MPSoC Modules TE0808-05
RRP USD 33.53
USD 10.58 *
* Excl. VAT
excl.
Shipping
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