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BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (30829)
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Item number VAR-827003400
Manufacturer Product Number: 30829
Taric/custom code: 84718000
Available for immediate dispatch: 0
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 20 euros.
Item located in and dispatched from: Riedlingen, Germany
USD 36.63
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Content
1 piece
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* Excl. VAT excl. Shipping
The BGA Heat Sink is a 17 x 17 x 17.5 mm standard heat sink with thermal tape. It is made of aluminium with blue anodized finish.
Features
- Series:maxiFLOW, superGRIP
- Type: Top Mount
- Material: Aluminium
- Material Finish: Blue Anodized
- Attachment Method: Clip, Thermal Material
- External dimensions:17 x 17 x 17.5 mm
- Thermal resistance at forced air flow: 8.30C/W @ 200 LFM
Scope of Delivery
- 1 xHeat sink forTrenz Electronic modules from TE0724 series REV04 (TE0724-04-xxx)
Additional Information
- Manufacturer:QATS, Advanced Thermal Solutions, Inc.
- Manufacturer'sarticle number: ATS-X50170P-C1-R0
- RoHS-6 conform: yes
- REACH compliant: yes
- Support Forum
The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.
| Technical characteristic | Value |
|---|---|
| Item ID | 102914 |
| Condition | New |
| Legacy item ID | 019685677b1471bca07624b1f7859dd7 |
| Model | 30829 |
| Manufacturer | |
| Manufacturing country | Germany |
| Content | 1 piece |
| Weight | 50 g |
| Customs tariff number | 84718000 |
SoC Module with AMD Zynq 7010-1I, 1 GByte DDR3L, 64 MByte Flash, 4 x 6 cm (TE0724-04-41I33-A)
USD 164.83 *
* Excl. VAT
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Shipping
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* Excl. VAT
excl.
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SoC Module with AMD Zynq 7010-1I, 1 GByte DDR3L, 64 MByte Flash, 4 x 6 cm (TE0724-04-41I33-A)
USD 164.83 *
* Excl. VAT
excl.
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FPGA Module with AMD Artix 7A35T-2I, 16 MByte Flash, 3,3V Config., 3 x 4 cm, LP (TE0714-04-42I-7-L)
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* Excl. VAT
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