Heat Sink for TEI1000 series (FA35-K29B-T725)

Please follow the installation instructions!

The 35 x 35 x 24.6 mm heat sink from radian works with natural convection and a thermal resistance of 9.44 °C/Watt.

The heat sink is mounted on the chipset.

Features

• Material: Aluminium
• External dimensions: 35 × 35 × 24.6 mm
• Chip Size: 35
• Voltage: 12V

Scope of Delivery

• 1 x Heat Sink for Trenz Electronic TEI1000 series

Additional Information

• Manufacturer's article number: FA35-K29B-T725
• Download Data Sheet
• Download Assembly Instructions
• Trenz Electronic Wiki Cooling Solutions Overview
• Support Forum