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Trenz Electronic GmbH
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Item number VAR-827001460
Manufacturer Product Number: ATS-X50170P-C1-R0
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 32.00
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Content
1 piece
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| Item ID | 101238 |
| Condition | New |
| Legacy item ID | 3432 |
| Model | ATS-X50170P-C1-R0 |
| Manufacturer | Trenz Electronic GmbH |
| Manufacturing country | Germany |
| Content | 1 piece |
| Weight | 800 g |
| Net weight | 800 g |
| Customs tariff number | 84718090 |
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* Excl. VAT
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* Excl. VAT
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Micromodule with AMD Kintex UltraScale KU040, 2 GB DDR4, 4 x 5, low profile (TE0841-03-41I31-L)
EUR 1,809.00 *
* Excl. VAT
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